| Services |
Design, Develop & Manufature:
We design, Develop & manufacture the following products:
 Fully automatic custom machines to trim, form, mold and assemble semiconductor devices like SOIC, PLCC QSOP, TQFP, QFP,TO, SOT, Diode, Fuse…etc.
Pick and Place machines with x-y stage.
Precise mechanical, hydraulic, SERVO and pneumatic presses from 1-12 Tons.
Process development, product design and R amp;D.
Visual inspection machines using CCD Cameras amp; Vision guided Robotics Feeds.
Reel-to-Reel high-speed metal/non metal stamping machines.
Custom High speed die bonding with solder dispense and vision inspection machines.
All the above equipment's could incorporate:
PLC's or Embedded controls, LED, LCD or touch screen MMI, Servo Motors, Stepper motors, Linear actuators, X-Y stages, High precision mechanical drives and components, pneumatics and vacuum accessories, Vision inspection with CCD cameras, Solder dispensing, sensors…………etc.
REFURBISH SEMICONDUCTOR EQUIPMENT:
We refurbish semiconductor equipment or upgrade to suite to new packages/process. The equipment could be pick & place, laser marking, dispensing, Vision, tape & reel, trim form, Molding, Scribe & break, Handler…etc.
We have a lot of experience in manufacturing custom designed equipment to assemble, test or pack precisely any type of semiconductor devices or products from other industries. Our products meet or exceed all the safety requirements using safety doors or light curtains. We at Nissen provide top class service from project initiation, fabrication to put the machine in production environment.
|
| |
|
|
|